Product Code:
Охл.271-300-DIN
The cooler is designed to remove heat generated by power semiconductor devices: solid-state relays and power modules into the cooling medium.
Heat sinks coolers are made of aluminum pressed profiles of alloy AD31 GOST 4784-97. Heat sinks do not require additional protective coating when operating in various climatic zones.
When ordering a cooler, the necessary mounting holes for one or more modules are made in the cooler together with the devices.
